BGA Reballing stacijas

BGA Reballing stacijas

BGA Reballing stacijas: professional reballing. 89+ noliktavā.

BGA Reballing stacijas

Complete equipment for BGA reballing and rework: infrared stations, reflow ovens, PCB preheaters, direct and universal BGA stencils, solder balls in various diameters (0.2mm to 0.76mm), and reballing jigs. Brands such as Achi, LY, Scotle, and Infrared BGA. Professional solutions for GPU, chipset, and processor repair on consoles and laptops.

What do I need for GPU and BGA chip reballing?

For BGA reballing you need: a hot air or infrared station with precise temperature control, a PCB preheater to prevent warping, specific BGA stencils for the chip being repaired, solder balls of the correct diameter (usually 0.5mm or 0.6mm for GPUs), BGA flux (such as Amtech), and a reballing jig or fixture. For console chips (PS3, Xbox 360), direct stencils greatly simplify the process.

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Insa M962 krāsns lampas rezerves daļa

18,15
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iPhone 5C IC stencil plate for BGA reballing by Mlink

3,63
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iPhone 6 stencil plate BGA lodēšanai un precīzam remontam

3,63
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Keramikas IR sildītājs 12x6cm lodēšanas un reballing stacijām

13,31
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