BGA Reballing stacijas

BGA Reballing stacijas

BGA Reballing stacijas: professional reballing. 89+ noliktavā.

BGA Reballing stacijas

Complete equipment for BGA reballing and rework: infrared stations, reflow ovens, PCB preheaters, direct and universal BGA stencils, solder balls in various diameters (0.2mm to 0.76mm), and reballing jigs. Brands such as Achi, LY, Scotle, and Infrared BGA. Professional solutions for GPU, chipset, and processor repair on consoles and laptops.

What do I need for GPU and BGA chip reballing?

For BGA reballing you need: a hot air or infrared station with precise temperature control, a PCB preheater to prevent warping, specific BGA stencils for the chip being repaired, solder balls of the correct diameter (usually 0.5mm or 0.6mm for GPUs), BGA flux (such as Amtech), and a reballing jig or fixture. For console chips (PS3, Xbox 360), direct stencils greatly simplify the process.

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Keramikas IR sildītājs 6x20cm lodēšanas stacijām Uyigao

14,52
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Mlink 294 stencils komplekts karstai lodēšanai BGA reballingam

84,70
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Mlink antistatiska birste reballing Tipo-3 PCB tīrīšanai

2,06
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Mlink liels antistatisks birste reballingam type-10

3,63
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Mlink mazā antistatiskā birste reballingam Tipo-1

2,06
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Mobilais reballing komplekts ar dubultu regulāciju 80 mm un 90 mm

61,71
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Puhui T-8280 infrasarkanais priekšsildītājs PCB un BGA

157,30
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Puhui T-962 V2.0 infrasarkanais reflow krāsns PCB un SMD BGA

229,90
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Samsung Note 3 IC stencil plate BGA remontam ar tiešu siltumu

3,63
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