3,63 €
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iPhone 5S IC stencil plate for professional repair with reballing template
Zīmols: Mlink
3,63€
Ieskaitot PVN (Bez PVN: 3,00 €)
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| Daudzums | Cena | Saglabāt |
|---|---|---|
| 2+ | 3,48 € | -4% |
| 10+ | 3,30 € | -9% |
| 20+ | 2,90 € | -20% |
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Standarta piegāde
Ot, Mai 5 - Ce, Mai 7
Eksprespiegāde
Pk, Mai 1 - Pr, Mai 4
30 dienu atgriešana
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iPhone 5S IC stencil plate is an essential tool for electronic repair of iPhone 5S devices, especially for reballing work and soldering BGA (Ball Grid Array) components. This direct heat stencil plate contains all the necessary areas to apply solder precisely to the iPhone 5S integrated circuits, making the process efficient and professional.
Manufactured by Mlink, this template is designed to fit perfectly with the iPhone 5S BGA chips, ensuring exact alignment and even heat distribution during the soldering process. It is an indispensable accessory for repair technicians looking for high-quality, durable results in their work.
Main features:
- Specific design for iPhone 5S, compatible with all BGA integrated circuits of the device.
- Direct heat plate that allows efficient and controlled heat transfer during the soldering process.
- Durable material that withstands high temperatures without deforming, ensuring precision with every use.
- Facilitates even solder application for reballing, improving the electrical connection of components.
- Professional accessory ideal for repair shops and technicians specialized in Apple devices.
Typical uses:
- Reballing of iPhone 5S BGA chips to restore the functionality of damaged components.
- Repair and maintenance of motherboards with soldering issues in integrated circuits.
- Optimization of the soldering process in precision electronic repairs.
Compatibility:
This stencil plate is designed exclusively for the iPhone 5S model and its BGA integrated circuits. It is not compatible with other iPhone models or electronic devices.
With this tool, technicians can ensure a faster, more precise and effective repair, reducing the risk of damage and improving service quality.
- Specific design for iPhone 5S and its BGA integrated circuits
- Direct heat plate for precise soldering
- Material resistant to high temperatures
- Facilitates reballing and BGA chip repair
- Professional tool for repair technicians
Klientu jautājumi un atbildes
What is the iPhone 5S IC stencil plate used for?
It is used to facilitate the reballing and soldering process of the iPhone 5S BGA integrated circuits, ensuring precision and quality in the repair.
Is it compatible with other iPhone models?
No, this stencil plate is designed exclusively for the iPhone 5S and is not compatible with other models.
What benefits does the direct heat plate offer?
It allows efficient and controlled heat transfer during soldering, improving the quality and durability of the repair.
What materials are used in this stencil plate?
It is made with high-temperature-resistant materials that ensure precision and durability during the soldering process.
Is it suitable for professional technicians?
Yes, it is a professional tool ideal for workshops and technicians specialized in Apple device repair.
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Klienti, kuri iegādājās šo preci, iegādājās arī
Universāls reballing trafaretu komplekts 90mmx90mm Mk-15/Ht90 ar 50 stencils
42,35€
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iPhone 5S IC stencil plate for professional repair with reballing template
3,63 €