3,63 €
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iPhone 6s Plus stencil plate for reballing and professional repair
Zīmols: Mlink
3,63€
Ieskaitot PVN (Bez PVN: 3,00 €)
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| Daudzums | Cena | Saglabāt |
|---|---|---|
| 2+ | 3,48 € | -4% |
| 10+ | 3,30 € | -9% |
| 20+ | 2,90 € | -20% |
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Pk, Mai 1 - Ot, Mai 5
Eksprespiegāde
Tr, Apr 29 - Ce, Apr 30
30 dienu atgriešana
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The iPhone 6s Plus stencil plate from the Mlink brand is a specialized tool for mobile device repair professionals, especially designed for the reballing process of BGA integrated circuits on the iPhone 6s Plus.
This direct heat stencil allows precise and even application of solder balls onto BGA chips, making it easier to repair and maintain the iPhone 6s Plus logic board. Its design includes all the necessary positions for the device's original BGA integrated circuits, ensuring compatibility and efficiency in the job.
Key features
- Compatibility: Specifically designed for BGA integrated circuits of the iPhone 6s Plus.
- High-quality material: Made to withstand direct heat during the reballing process without deforming.
- Precision: Allows exact alignment of solder balls, improving repair quality.
- Professional use: Ideal for technicians and workshops specialized in mobile phone repair.
Typical uses
- Reballing of BGA chips on the iPhone 6s Plus logic board.
- Repair of faults related to defective solder joints in BGA integrated circuits.
- Maintenance and restoration of Apple mobile devices.
Compatibility and accessories
This stencil is compatible exclusively with the iPhone 6s Plus and its original BGA integrated circuits. It is recommended to use it together with soldering stations and reballing tools for optimal results.
In addition, it is part of the range of iPhone 6s Plus reballing accessories and iPhone 6s Plus repair tools offered by Mlink, ensuring quality and precision in every repair.
- Compatible with iPhone 6s Plus BGA integrated circuits
- Heat-resistant material for direct reballing heat
- Allows precise alignment of solder balls
- Ideal for mobile phone repair technicians
- Essential tool for reballing and maintenance
Klientu jautājumi un atbildes
What is the iPhone 6s Plus stencil plate used for?
It is used to facilitate the reballing process of BGA integrated circuits on the iPhone 6s Plus logic board, allowing precise soldering.
Is it compatible with other iPhone models?
No, this stencil plate is designed exclusively for BGA integrated circuits of the iPhone 6s Plus.
What materials can the stencil plate withstand?
It is made with materials resistant to the direct heat needed for the reballing process.
Where can I buy this stencil plate?
It is available for online purchase at satkit.com with fast and secure shipping.
Do I need additional tools to use the stencil plate?
Yes, it is recommended to use it together with soldering stations and reballing tools for better results.
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Universāls reballing trafaretu komplekts 90mmx90mm Mk-15/Ht90 ar 50 stencils
42,35€
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-4%
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iPhone 6s Plus stencil plate for reballing and professional repair
3,63 €