3,63 €
Ir noliktavā
iPhone 6S IC stencil plate for BGA repair with direct heat template
Zīmols: Mlink
3,63€
Ieskaitot PVN (Bez PVN: 3,00 €)
Apjoma atlaides
| Daudzums | Cena | Saglabāt |
|---|---|---|
| 2+ | 3,48 € | -4% |
| 10+ | 3,30 € | -9% |
| 20+ | 2,90 € | -20% |
Atlikuši tikai 3 — pasūtiet drīz!
Standarta piegāde
Ot, Mai 5 - Ce, Mai 7
Eksprespiegāde
Pk, Mai 1 - Pr, Mai 4
30 dienu atgriešana
Bezmaksas atgriešana 30 dienu laikā
Drošs darījums
Share:
Bezmaksas piegāde
Piegāde no 4,99€
Vienkārša atgriešana
30 dienu atgriešanas politika
Drošs maksājums
100% droši norēķini
Kvalitātes garantija
Tikai oriģināli produkti
The iPhone 6S IC stencil plate is an essential tool for repairing and reballing the BGA integrated circuits of the iPhone 6S. Made to offer precision and ease in solder application, this template enables efficient and professional work in Apple device repair.
Main features:
- Direct heat template that includes all BGA integrated circuits of the iPhone 6S.
- Designed to facilitate precise solder application on BGA components.
- Compatible exclusively with iPhone 6S, ensuring a perfect fit.
- Made by Mlink, a recognized brand in electronic repair accessories.
- Ideal for repair technicians and professionals in mobile electronics.
Typical uses:
- Reballing of BGA chips in iPhone 6S to restore electrical connections.
- Repair of motherboards that require replacement or maintenance of integrated circuits.
- Precise solder application to avoid damage to nearby components.
- Optimization of repair processes in workshops specialized in Apple devices.
Compatibility: This template is designed exclusively for the iPhone 6S, ensuring that each BGA integrated circuit area is properly covered for precise and safe work.
With this stencil plate, repair professionals can ensure high-quality work, minimizing errors and improving efficiency in iPhone 6S repairs. Its direct heat design makes the soldering process easier, making the task faster and more effective.
- BGA template for iPhone 6S with all integrated circuits included
- Allows reballing and precise repair of BGA chips
- Compatible exclusively with iPhone 6S
- Made by Mlink, a brand specialized in repair accessories
- Direct heat design that optimizes soldering
Klientu jautājumi un atbildes
What is the iPhone 6S IC stencil plate used for?
It is used to facilitate the repair and reballing of the BGA integrated circuits of the iPhone 6S through precise solder application with direct heat.
Is it compatible with other iPhone models?
No, this template is designed exclusively for the iPhone 6S to ensure optimal fit and precision.
Who should use this stencil plate?
It is intended for technicians and professionals in mobile device repair who perform soldering and reballing work on iPhone 6S.
What brand makes this template?
The iPhone 6S IC stencil plate is made by Mlink, a recognized brand in electronic repair accessories.
What advantages does the direct heat design offer?
The direct heat design allows more precise and efficient solder application, reducing the risk of damage and improving repair quality.
Rakstīt klienta atsauksmi
Klienti, kuri iegādājās šo preci, iegādājās arī
Universāls reballing trafaretu komplekts 90mmx90mm Mk-15/Ht90 ar 50 stencils
42,35€
Atlikuši tikai 8
Jūsu nesen skatītās preces
iPhone 6S IC stencil plate for BGA repair with direct heat template
3,63 €